Skip to main content
Edward Sabolsky
Multi-functional and Energy Ceramics Group

Facilities

Related Materials Synthesis and Processing*

  • N anoInk’s NLP 2000 Dip-Pen Nanolithography (DPN) system
  • Brookfield DV-II+Pro Viscometer
  • High-temperature furnaces (air and controlled-atmosphere <1700°C)
  • Tapecaster (Mistler) and screenprinter (DEK)
  • Computer-controlled laser cutter (Universal Laser Systems)
  • Precision CNC dicing saw 75 ton four-post heated platen uniaxial press (PHI)
  • Powder mills (roll and attrition mills)
  • Nanopowder autoclave reactor (Autoclave Engineers 300EZ)
  • Class 100, 1000, and 10,000 cleanrooms with photo- and e-beam lithography capabilities
  • Controlled-atmosphere glove box (Vacuum Atmosphere Company)
  • Vacuum/atmosphere controlled spin coater (Specialty Coating Systems P6700)
  • BET (Micromeritics ASAP 2020)Laser particle sizer (Malvern Mastersizer 2000S)
  • Nanopowder sizer (Malvern Zetasizer Nano-ZS)
  • Rheometer (Brookfield DV-III Ultra)
  • Intrusion Mercury Porosimeter (Micromeritics Autopor IV)
  • ULPA laminar flow hoods (ESCO)Rotavapor system (Buchi R-205)
  • Electron beam evaporator (BOC Temescal BJD-2000)
  • Sputtering station (CVC 610)PECVD (Oxford 80+ Ionfab)
  • LPCVD furnace (Tystar Mini-Tytan)Wedge-wedge and ball-wedge bonder (West Bond 747677E)
  • Hyrel 3D Engine SR Printer
  • Mechanical Polisher: Pace technologies Giga 0900 vibratory polisher, Pace technologies Nano 1000T grinder polisher

Materials Characterization Electrical Testing

  • Current-voltage-power (I-V-P) testing setup for fuel cells, sensors and batteries.
  • Electrical testing in various gases and fuels (Air, O 2, H 2, N 2, CO, CO 2, H 2O, CH 4) with various impurities (H 2S, PH 4, HCl)
  • Automated 4-probe conductivity and Seeback coefficient stands for testing at various temperatures and pO 2 levels
  • PEM single-cell and three-cell stack testing (ElectroChem MTS-150 PEM electrical loads with HSA humidity control)
  • Fuel cell planar test stands for large area cells (30-100 cm 2 active area)
  • Solartron 1260 and 1287 impedance/gain-phase analyzer with potentiostat
  • Digital multi-meters (Keithley 2000)
  • DC power supplies and loads (BK Precision)
  • Probe Stations (Rucker and Coles models 680, 666, 660 and 260)
  • Uniaxial mechanical testing systems (MTS Material Test System 810, Instron 3365)
  • LCR meters: BK precision 889B and Agilant E4980a
  • Sun Systems Controlled Temperature (-200 to 800°C) Environmental Chamber
  • TA Instrument DMA Q800 - Temperature Controlled Dynamic Mechanical Analyzer
  • Stellar Net Raman Spectrometer: 532 nm (Green light) Laser Module

Related Microscopy and Spectroscopy Capabilities*

  • X-ray Photoelectron spectroscopy (XPS- PHl 5000 VersaProb eTM)
  • Multifunctional scanning probe microscopy (PicoSPM® II)
  • Fourier Transform Infrared Spectroscopy (FTIR) with UMA 600 Microscope (DIGLAB FTS7000)
  • UV-Vis spectrometer equipped with the integration spheres accessory (Shimadzu 2550)3-D Hi-Scope Microscope (enables 360 degree dynamic rotation with oblique viewing)
  • Optical Microscope coupled with CCD camera (Leitz)
  • Atomic Force Microscopy (AFM)- (tapping, conductive, and electrochemical)
  • Electrostatic force microscopy (EFM)
  • Magnetic force microscopy (MFM)
  • Scanning tunneling microscopy (STM)
  • X-ray Diffractometer (XRD) (Bruker D8 Unit with heated stage and Panalytical X'Pert Powder)
  • JEOL 7600F Scanning Electron Microscope (SEM)/Oxford EDS and NPGS E-beam lithography software
  • Hitachi S4700 FE-Scanning Electron Microscope (SEM)/EDAX Energy dispersive X-ray Detector (EDX)
  • TEM sample preparation equipments including Model 1010 Ion-Mill from Fischione, MultiPrep™ System for semi-automatic polishing from Allied Hightech, TechCut 4™ Low Speed Saw from Allied Hightech, AxioImage light microscope with digital imaging from Zeiss, and Stereo Microscope.
  • JEOL JEM-2100 High Resolution Transmission Electron Microscope (HRTEM) (will be installed in September 2009), point-to-point resolution of 0.23nm, high tilting capabilities, CCD camera digital imaging for electron diffraction, diffraction contrast and HRTEM imaging.

* Some equipment available through WVNano user facility